Despite Infinera’s claims of significant integration between the two product lines, its purchase of Coriant is really about the continuing shortcomings of its PIC strategy,…
Category: Chips
Finisar: New VCSEL Opportunities Possible
In June, this writer was honored to be a keynote speaker at EPIC’s meeting on “Singlemode vs Multimode Communication” in Kessel-Lo, Belgium. Our preliminary judgement…
Silicon Photonics: Last Gasp of Hype
The optics industry is approaching 50 years since the concept of Silicon Photonics (SiPh) was mentioned for the first time. During an upsurge in excitement…
Facebook: Co-Packaged Optics Conundrum
While we have recently pointed out that co-packaged optics will not be the great enabler of Silicon Photonics (SiPh), the concept of markedly shortening the…
Finisar/II-VI: Elongated 3D Sensing Ramp
At least a few analysts on the Street are asking: Why is the time for Finisar and II-VI seemingly so extended out for a considerable…
ams: Turnkey Play for Android VCSELs
We recently looked at the negative ramifications for VCSEL vendors supplying Apple for 3D Sensing (3DS) purposes, as the iPhone supplier has transformed the business…
Incredible Shrinking 3DS VCSEL Margins Projected
With eventually five or more six-inch VCSEL fab manufacturers playing in the worldwide 3D sensing space, the generation of impressive margins will get increasingly tougher,…
Lumentum 3DS at Apple: A Competitive Analysis
Right now, it seems that Lumentum’s primary challengers for VCSELs for 3D Sensing (3DS) applications for use in Apple’s iPhones will probably remain both Finisar…
Co-Packaged Optics on Trial
Recently, fibeReality has written about the latest catchphrase in the optics space, co-packaged optics, and mentioned the potential challenges with expense and yield, as well…
400GbE: Wakeup Call for Hyperscale Operators
When it comes to the critical development efforts for 400GbE, the big-four hyperscale data center operators do not appear to be doing much more than…
